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查看COMSOL 用户年会 2026论文

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Predictive Modeling of MEMS-Hotplates - From Inverse Modeling to Experimental Validation

Toni Schildhauer¹, Andreas T. Winzer¹
¹CiS Forschungsinstitut für Mikrosensorik GmbH, Erfurt, Germany

This work presents a comprehensive modeling and validation study of MEMS-based infrared (IR) emitter chips ...扩展阅读

Reconfigurable Optofluidic Barriers for 3D Particle Control via Thermally Induced Flows

E. Ruiz-Reina¹, F. Schmidt², C. D. González-Gómez³, M. Sulliger², R. A. Rica-Alarcón⁴, J. Ortega-Arroyo², R. Quidant²
¹Multiphysics Modeling School, Department of Applied Physics II, University of Málaga
²Department of Mechanical and Process Engineering, ETH Zurich
³Department of Applied Physics, University of Granada
⁴Research Unit ‘Modeling Nature’ (MNat), Department of Applied Physics, University of Granada

Microfluidic systems traditionally rely on fixed physical barriers to manipulate fluids and particles. While ...扩展阅读

Retention force and its frictional contribution influence on the plug-socket connection stability

A. Tziotziou¹, O. Antoniuk¹, B. Haayen², M. Colloca²
¹Sonion Nederland, B.V., Hoofddorp, the Netherlands
²Sonion Nederland, B.V., Hoofddorp, the Netherland

Retention force and its frictional contribution influence on the plug-socket connection stability Aikaterini ...扩展阅读

Robust Implementation of Neumann Boundary Conditions in COMSOL-VIPER for Realistic Bentonite Hydration at Limited Water Supply

Michael Kröhn¹
¹GRS gGmbH, Braunschweig, Germany

The thermo-hydraulically coupled code COMSOL-VIPER (Kröhn and Fromme 2023) based on the balance equations of ...扩展阅读

Selective Stray Light Suppression in Photodiode Modules via Structured Black Photoresist

T. Fink¹, D. Mitrenga¹, M. Jahn¹, A. Winzer¹
¹CiS Forschungsinstitut für Mikrosensorik GmbH

Stray light represents a significant challenge in a wide range of photodiode and photodiode array ...扩展阅读

Simulation and Experimental Validation of Mixing Performance in a Batch Mixer

Siqin Tao¹, Hasan Aljeratli¹, Matthias Sunder¹, Lena Kögel², Laura Lenters², Heyko Jürgen Schultz²
¹Henkel AG & Co. KGaA, Düsseldorf
²University of Applied Sciences Niederrhein

This study presents a combined simulation and experimental investigation of mixing performance in a batch ...扩展阅读

Simulation and validation of transfer molding process of large-scale power semiconductor module

C. Kocher¹, N. Hofmann¹, D. Guillon²
¹University of Applied Sciences Northwestern Switzerland, School of Engineering and Environment, Institute of Thermal and Fluid Engineering, Windisch, Switzerland
²Hitachi Energy, Lenzburg, Switzerland

The transfer molding process is a widely used method for encapsulating microelectronics and power ...扩展阅读

Simulation Apps at LEONI: Use Cases, Challenges and Solutions within a global company

Michael Dauer¹, Maximilian Weber¹
¹LEONI Wiring Systems, Kitzingen, Bavaria, Germany

With the Creation, roll-out, and maintenance of COMSOL Simulation apps, the role of simulation engineers and ...扩展阅读

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