Prestress Analysis for Thermal Stress Analysis

Please login with a confirmed email address before reporting spam

Hi All,

I am doing Prestress analysis of Power Module where after the soldering is done, we cool it down from 230 degC to 25 degC. Now because of this cooling, the power module will shrink and because of that there will be some stress in it. Now, when I use this power module and heat it from 65 degC to 130 degC, the stresses generated due to the shrinkage should be revealed from the power module. I am trying to replicate this scenario.

For that, I have performed the prestress simulation in COMSOL and I have added one more physics of Thermal Stress and one more study to perform the 2nd simulation. For the 2nd Simulation, I clicked on get initial value and ran the simulation. But this procedure does not seems to give me correct results. Does anyone know whether this method is correct or not? I have attached the photo here for your reference.



0 Replies Last Post 2025年9月23日 GMT+2 18:34
COMSOL Moderator

Hello Aaryan Shah

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Reply

Please read the discussion forum rules before posting.

Please log in to post a reply.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.

Baidu
map