论文和技术资料

This paper deals with the design of a viable thermal management solution using La₅Ca₉Cu₂₄O₄₁layers for heat channeling. The simulations are carried out with the finite element method using COMSOL Multiphysics Heat Transfer Module.

COMSOL 4.2 was used to model and optimize silicon devices. Malfunctioning elements on silicon devices are sometimes converted into hotspots resulting in the increase of their temperature and that of the adjacent elements. The simulations carried out demonstrate a temperature decrease of the adjacent elements when La₅Ca₉Cu₂₄O₄₁layers are introduced in such devices.