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Posted:
2 years ago
2025年1月25日 GMT+8 07:38
I think you want to model thermal expansion due to temperature variation. This is a built-in multiphysics coupling using Solid Mechanics and Heat Transfer in Solids. No need for moving mesh.
I think you want to model thermal expansion due to temperature variation. This is a built-in multiphysics coupling using Solid Mechanics and Heat Transfer in Solids. No need for moving mesh.
Jeff Hiller
COMSOL Employee
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Posted:
2 years ago
2025年1月27日 GMT+8 21:39
Updated:
2 years ago
2025年1月27日 GMT+8 21:44
Hello Rayian,
As David pointed out, thermal expansion in solids is pre-implemented in the software. Note that this is a feature found in the optional Structural Mechanics Module and in the optional MEMS Module. To see if your license includes either of these two products, go to File > Licensed and Used Products.
It is also possible to add thermal expansion without either of those modules by adding terms to the equations, as illustrated inthis tutorial.
Best regards,
Jeff
-------------------
Jeff Hiller
Hello Rayian, As David pointed out, thermal expansion in solids is pre-implemented in the software. Note that this is a feature found in the optional Structural Mechanics Module and in the optional MEMS Module. To see if your license includes either of these two products, go to File > Licensed and Used Products. It is also possible to add thermal expansion without either of those modules by adding terms to the equations, as illustrated in [this tutorial](https://www.comsol.com/model/thermal-microactuator-simplified-16357). Best regards, Jeff